At the 16th international MID Congress (Mechatronic Integrated Discourse) in Amberg, the paper “Investigating Wire Encapsulating Additive Manufacturing for Mechatronic Integrated Devices” by Markus Ankenbrand, Tanmay Ulhas Naphe, Finn Gohlke, Kok Siong Siah, Prof. Jörg Franke and Prof. Florian Risch...