Year: 2025

This year's Computer Science Day on 25.04.2025 in H9 once again offered the opportunity to experience top-class lectures on current topics in computer science. Prof. Dr. Florian Rabe gave his inaugural lecture in this context. There were also exciting presentations by Prof. Dr. Matthias Nießner (TU ...

Category: News

Two of the ten “Most Influential Papers” of the last 20 years of the International Symposium on Applied Reconfigurable Computing (ARC) are from the Chair of Hardware-Software Co-Design at FAU. The publications were selected based on several quality criteria in a multi-stage process. ESI-Member PD Dr...

Category: News

FAU ESI once again took part in the BayernInnovativ joint stand at the Hannover Messe 2025, which ended on April 4, 2025. There was a great deal of interest in “Research and Technology Transfer” in Hall 2, and Minister of State Aiwanger also visited the BayernInnovativ stand. We are delighted with t...

Category: News

At the 10th specialist colloquium of the Scientific Society for Assembly, Handling and Industrial Robotics (MHI e.V.) in Berlin, Dr. Maximilian Metzner, alumnus of the Chair of FAPS, was awarded the MHI Doctoral Prize 2024. The MHI Board of Directors recognized his outstanding dissertation on “Plann...

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Julian Dahlmann, Andreas Völz and Knut Graichen received the Best Paper Award 2024 of the journal at – Automatisierungstechnik in the applications category for their work “A Concept for Automated Maneuvering of Vehicles with Trailers (in German)”. The award was presented at the 59th Control Engineer...

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Frank Hannig received an “Outstanding Reviewer Award” for his reviewer activities as a member of the Technical Program Committee (TPC) of the Design Automation and Test in Europe (DATE 2025) conference. Only 1.7% of all 591 TPC members received the award. Hannig: “I am delighted that I was selected ...

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“3D-HF-MID” - The DFG research group with Prof. Dr.-Ing. Jörg Franke from the Chair of FAPS as spokesperson starts on April 1, 2025 and researches the spatial design of high-frequency systems using integrated electronic 3D assemblies - so-called Mechatronic Integrated Devices (MID). An interdiscipli...

Category: News