DFG Forschungsgruppe 3D-HF-MID

Whether in the automotive and aviation industries or in telecommunications and information technology, many successful sectors in Germany are facing the challenge that conventional assembly and connection technology for high-frequency assemblies has already reached its technological limits. Therefore, a design and manufacturing methodology is being sought that enables the assembly of such components with outstanding surface quality, a wider choice of materials, and an economical manufacturing process on three-dimensional base bodies. This topic area forms the core of the DFG research group “3D-HF-MID.”

The use of so-called Mechatronic Integrated Devices (MID) opens up completely new possibilities for the spatial design of high-frequency components. An interdisciplinary team from FAU (Chairs of Manufacturing Automation and Production Systems – FAPS, High Frequency Technology – LHFT, and Institute Materials for Electronics and Energy Technology – i-MEET) and the Helmholtz Institute Erlangen-Nürnberg will investigate the entire process chain, including material synthesis, geometric design, and manufacturing processes, both simulatively and physically. This interdisciplinary collaboration will lay the foundations for a newly conceived design methodology and manufacturing process technology for spatial high-frequency systems.

You will find further information at the project’s Web site or at LHFT’s Web page.

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