Best Paper Award at International MID Congress for Markus Ankenbrand

At the 16th international MID Congress (Mechatronic Integrated Discourse) in Amberg, the paper “Investigating Wire Encapsulating Additive Manufacturing for Mechatronic Integrated Devices” by Markus Ankenbrand, Tanmay Ulhas Naphe, Finn Gohlke, Kok Siong Siah, Prof. Jörg Franke and Prof. Florian Risch received the Best Paper Award.

The award-winning paper examines the use of WEAM technology for the direct integration of wires on and in additively manufactured three-dimensional circuit carriers. A special print head is used that combines a wire feeder with a fused filament fabrication (FFF) extruder. The wire is deposited directly under the melted plastic and simultaneously fixed and insulated. Among other things, a heating structure made of nichrome wire and a fully additively manufactured bending sensor that detects deformations via changes in resistance were demonstrated. In addition, mechanical tests such as tensile tests and peel tests were carried out to evaluate the adhesion of the printed wires.

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