NewsBest Paper Award at International MID Congress for Markus Ankenbrand
At the 16th international MID Congress (Mechatronic Integrated Discourse) in Amberg, the paper “Investigating Wire Encapsulating Additive Manufacturing for Mechatronic Integrated Devices” by Markus Ankenbrand, Tanmay Ulhas Naphe, Finn Gohlke, Kok Siong Siah, Prof. Jörg Franke and Prof. Florian Risch received the Best Paper Award. The award-winning paper examines the use of WEAM technology for […]At the 16th international MID Congress (Mechatronic Integrated Discourse) in Amberg, the paper “Investigating Wire Encapsulating Additive Manufacturing for Mechatronic Integrated Devices” by Markus Ankenbrand, Tanmay Ulhas Naphe, Finn Gohlke, Kok Siong Siah, Prof. Jörg Franke and Prof. Florian Risch received the Best Paper Award. The award-winning paper examines the use of WEAM technology for […]