Whether in the automotive and aviation industries or in telecommunications and information technology, many successful sectors in Germany are facing the challenge that conventional assembly and connection technology for high-frequency assemblies has already reached its technological limits. Therefore, a design and manufacturing methodology is being sought that enables the assembly of such components with outstanding surface quality, a wider choice of materials, and an economical manufacturing process on three-dimensional base bodies. This topic area forms the core of the DFG research group “3D-HF-MID.”
The use of so-called Mechatronic Integrated Devices (MID) opens up completely new possibilities for the spatial design of high-frequency components. An interdisciplinary team from FAU (Chairs of Manufacturing Automation and Production Systems – FAPS, High Frequency Technology – LHFT, and Institute Materials for Electronics and Energy Technology – i-MEET) and the Helmholtz Institute Erlangen-Nürnberg will investigate the entire process chain, including material synthesis, geometric design, and manufacturing processes, both simulatively and physically. This interdisciplinary collaboration will lay the foundations for a newly conceived design methodology and manufacturing process technology for spatial high-frequency systems.
You will find further information at the project’s Web site or at LHFT’s Web page.
Prof. Dr.-Ing. Jörg Franke
Chair of Factory Automation and Production Systems
Professors
Prof. Dr.-Ing. Martin Vossiek
Chair of Microwaves and Photonics
Professors