NewsFAU ESI as exhibitor at the Hanover Fair 2025
FAU ESI will be represented at the BayernInnovativ joint stand in Hall 2 (Stand A42) from March 31 to April 4, 2025. We will be showing a demonstrator with the ALPACA chip there. The chip, called ALPACA, integrates 64 computing cores developed in-house at the chair of Hardware-Software-Co-Design by ESI speaker Prof. Dr.-Ing. Jürgen Teich […]FAU ESI will be represented at the BayernInnovativ joint stand in Hall 2 (Stand A42) from March 31 to April 4, 2025. We will be showing a demonstrator with the ALPACA chip there. The chip, called ALPACA, integrates 64 computing cores developed in-house at the chair of Hardware-Software-Co-Design by ESI speaker Prof. Dr.-Ing. Jürgen Teich […]
