FAU ESI took part in the BayernInnovativ joint booth at the Hannover Messe 2024, which ended on 26.04.2024. The interest in “Your Future” in Hall 2 was very high. We are delighted with the many exciting and often technically in-depth discussions that took place at the stand. We were showing a demonstrator from the ReProVide project (part of the DFG SPP 2037), which is about near-data processing of data streams on reconfigurable SoCs for big data applications in the IoT and in which the Chairs of Computer Science 6 (Data Management) of Prof. Dr.-Ing. Klaus-Meyer-Wegener and Chair of Computer Science 12 (Hardware-Software-Co-Design) of ESI speaker Prof. Dr.-Ing Jürgen Teich participated.
Dr.-Ing. Torsten Klie
FAU Research Center Embedded Systems Initiative (ESI)
Geschäftsstelle
- Telefon: +49913185-25151
- E-Mail: torsten.klie@fau.de