Successful completion of the A4I-PE3D Project: “Additive4Industry – Printed electronics on 3D substrates”

As part of the three-year research project “Additive4Industry – Printed electronics on 3D substrates (A4I/PE3D)”, the Federal Ministry of Education and Research (BMBF), under the leadership of the Jülich project management organization, funded research into additively manufactured ceramic circuit carriers for electronic assemblies as well as their metallization and qualification.

As the performance of electronic assemblies increases, so do the requirements for improved electrical insulation and thermal conductivity. At the same time, planar modules are reaching their limits in terms of design freedom and small batch sizes.
The technical consortium, consisting of the partners FAPS, Conti Temic microelectronic GmbH, Neotech AMT GmbH and GSB-Wahl GmbH as well as the TNO/Holst Centre as an associated international partner, therefore investigated the use of ceramic materials for the 3D printing of substrates (mainly aluminum oxide and LTCC ceramics). Commercially available functional inks as well as in-house productions from project partner GSB-Wahl were applied to the complex ceramic surfaces using piezojet printing and extensively characterized.

Further information on the FAPS website.

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