{"id":2030,"date":"2025-07-03T12:56:46","date_gmt":"2025-07-03T10:56:46","guid":{"rendered":"https:\/\/www.esi.fau.de\/?p=2030"},"modified":"2026-01-30T17:48:52","modified_gmt":"2026-01-30T16:48:52","slug":"best-paper-award-auf-dem-international-mid-congress-fuer-markus-ankenbrand","status":"publish","type":"post","link":"https:\/\/www.esi.fau.de\/en\/2025\/07\/03\/best-paper-award-auf-dem-international-mid-congress-fuer-markus-ankenbrand\/","title":{"rendered":"Best Paper Award at International MID Congress for Markus Ankenbrand"},"content":{"rendered":"\n<p>At the 16th international MID Congress (Mechatronic Integrated Discourse) in Amberg, the paper \u201cInvestigating Wire Encapsulating Additive Manufacturing for Mechatronic Integrated Devices\u201d by Markus Ankenbrand, Tanmay Ulhas Naphe, Finn Gohlke, Kok Siong Siah, Prof. J\u00f6rg Franke and Prof. Florian Risch received the Best Paper Award.<\/p>\n\n\n\n<p>The award-winning paper examines the use of WEAM technology for the direct integration of wires on and in additively manufactured three-dimensional circuit carriers. A special print head is used that combines a wire feeder with a fused filament fabrication (FFF) extruder. The wire is deposited directly under the melted plastic and simultaneously fixed and insulated. Among other things, a heating structure made of nichrome wire and a fully additively manufactured bending sensor that detects deformations via changes in resistance were demonstrated. In addition, mechanical tests such as tensile tests and peel tests were carried out to evaluate the adhesion of the printed wires.<\/p>\n\n\n<div class=\"fau-person thumb-size-small border\" itemscope itemtype=\"http:\/\/schema.org\/Person\">\n<div class=\"row\"><div class=\"person-default\"><h3><a href=\"https:\/\/www.esi.fau.de\/person\/prof-franke\/\"><span itemprop=\"name\"><span itemprop=\"honorificPrefix\">Prof. Dr.-Ing.<\/span> <span class=\"fullname\"><span itemprop=\"givenName\">J\u00f6rg<\/span> <span itemprop=\"familyName\">Franke<\/span><\/span><\/span><\/a><\/h3><div class=\"person-info\"><span class=\"person-info-position\" itemprop=\"jobTitle\">Lehrstuhlinhaber<\/span><br><p itemprop=\"worksFor\" itemtype=\"http:\/\/schema.org\/Organization\"><span itemprop=\"name\">Department of Mechanical Engineering<\/span><br><span itemprop=\"department\">Institute for Factory Automation and Production Systems (FAPS, Prof. Franke)<\/span><br><\/p><ul class=\"contactlist\"><li class=\"person-info-phone telephone\"><span class=\"screen-reader-text\">Telefon: <\/span><a itemprop=\"telephone\" href=\"tel:+49-9131-85-27569\">+49 9131 85-27569<\/a><\/li><li class=\"person-info-email email\"><span class=\"screen-reader-text\">E-Mail: <\/span><a itemprop=\"email\" href=\"mailto:joerg.franke@faps.fau.de\">joerg.franke@faps.fau.de<\/a><\/li><\/ul><\/div><\/div><\/div><\/div>\n","protected":false},"excerpt":{"rendered":"<p>At the 16th international MID Congress (Mechatronic Integrated Discourse) in Amberg, the paper \u201cInvestigating Wire Encapsulating Additive Manufacturing for Mechatronic Integrated Devices\u201d by Markus Ankenbrand, Tanmay Ulhas Naphe, Finn Gohlke, Kok Siong Siah, Prof. J\u00f6rg Franke and Prof. Florian Risch received the Best Paper Award. The award-winning paper examines the use of WEAM technology for [&hellip;]<\/p>\n","protected":false},"author":911,"featured_media":2028,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_rrze_cache":"enabled","_rrze_multilang_single_locale":"en_US","_rrze_multilang_single_source":"https:\/\/www.esi.fau.de\/?p=2027","footnotes":""},"categories":[8],"tags":[17],"class_list":["post-2030","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-aktuelles","tag-preis","en-US"],"_links":{"self":[{"href":"https:\/\/www.esi.fau.de\/wp-json\/wp\/v2\/posts\/2030","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.esi.fau.de\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.esi.fau.de\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.esi.fau.de\/wp-json\/wp\/v2\/users\/911"}],"replies":[{"embeddable":true,"href":"https:\/\/www.esi.fau.de\/wp-json\/wp\/v2\/comments?post=2030"}],"version-history":[{"count":2,"href":"https:\/\/www.esi.fau.de\/wp-json\/wp\/v2\/posts\/2030\/revisions"}],"predecessor-version":[{"id":2427,"href":"https:\/\/www.esi.fau.de\/wp-json\/wp\/v2\/posts\/2030\/revisions\/2427"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.esi.fau.de\/wp-json\/wp\/v2\/media\/2028"}],"wp:attachment":[{"href":"https:\/\/www.esi.fau.de\/wp-json\/wp\/v2\/media?parent=2030"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.esi.fau.de\/wp-json\/wp\/v2\/categories?post=2030"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.esi.fau.de\/wp-json\/wp\/v2\/tags?post=2030"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}